Plasma Equipment (with Henger Microelectronics)
等离子设备（与恒格微电子合作）
Semiconductor Equipment Housings
半导体设备外壳
Precision-fabricated plasma processing equipment enclosures and structural components, jointly developed with Henger Microelectronics for semiconductor applications
与恒格微电子联合开发的精密等离子设备外壳与结构件，用于半导体应用
Custom Fabrication 定制加工
Dimensions, material grade, thickness, surface finish and quantity are made to your drawings. Send your files for a manufacturability review and quotation.
尺寸、材料牌号、厚度、表面处理与数量均可按您的图纸定制。发送文件即可获得可制造性评审与报价。
Related Products
相关产品
Wafer Processing Chamber
晶圆处理腔体
Ultra-clean stainless steel chamber with high vacuum compatibility for semiconductor manufacturing
具备高真空兼容性的超高洁净不锈钢腔体，用于半导体制造
View Details 查看详情 →Etching System Enclosure
刻蚀系统外壳
Corrosion-resistant housing with integrated gas delivery system for plasma etching processes
集成气体输送系统的耐腐蚀外壳，用于等离子刻蚀工艺
View Details 查看详情 →